New packaging technology to improve the performance and thermals of the Exynos 2400 SoC - TechDoms

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New packaging technology to improve the performance and thermals of the Exynos 2400 SoC

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Samsung Foundry is expected to use a new packaging technology to improve the performance of the Exynos 2400 chipset.

from PhoneArena https://ift.tt/4Ucq7Cs

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